Resume

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Education

Master of Science, Chemistry, solid state....................................... Arizona State University, Tempe, Arizona
Bachelor of Science, Chemistry, inorganic.................................... University of Cincinnati, Cincinnati, Ohio

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Professional Experience

Faraday Solutions LLC, Chandler, AZ ................................................... March 2009 - Present

Founder, Materials and Plating Specialist.  Created consulting business to assist companies in determining materials sets and processes for development of solar, medical and semiconductor products.

• Primary consultant for Quest Product Development, collaborated with Colorado School of Mines and University of Colorado teams to develop a nitinol-based micro-endoscope. He helped manufacture controllable thin-film heaters using spin-on dielectrics on nitinol foils and created a non-aqueous electrochemical etching process for patterning these foils into specialized structures.

• Consulted on various projects for other clients including, electrochemical methods to produce IR transparent germanium mirrors, electroplated indium bumps for infrared CCD cameras, and deposition of superconducting films for supercomputer chips. In addition, helped semiconductor tool makers source electroplating suppliers for protective coatings and advised on a patent case involving flip-chip bumping processes.

Freescale Semiconductor Inc., Tempe, AZ ........................................................... 2004 - 2009

Distinguished Member of the Technical Staff. Initiated development of revolutionary polymer wafer fabrication processes for Freescale’s innovative “Redistributed Chip Package” (RCP). This process was ultimately licensed to subcontractors and became a model for competitors.

• Designed and built unique tools for manual fabrication of polymer wafers (panels) during development of new packaging process. Concepts and ideas were implemented into automated robotic tooling. Three patents pending.

• Identified sources and developed preliminary material lists for RCP processing to facilitate bill of materials generation, inventory management, and just-in-time delivery schedules. Conducted quantitative analyses of chemical usage rates and wastewater treatment requirements using material data. Provided guidance to facility planners and contractors on the design of chemical storage and waste treatment systems for the RCP manufacturing line.

Motorola Inc. Semiconductor Products Sector (SPS), Tempe, AZ & Austin, TX...... 1982 - 2004
Senior Member of the Technical Staff Primarily involved in development of electrochemical plating processes for semiconductor packaging.

• Oversaw the adoption of lead-free plating in Flip-Chip manufacturing, including developing lead-free alloy plating baths and compatible seed metal etchants for semiconductor devices.

•Co-invented solder bumping process for Flip-Chip attach of a GaAs optical display for use in the worlds first sub-miniature monochromatic digital display.

• Developed etchant formulations and processes to allow manufacture of plated inductors on silicon.

• Developed a fountain wafer plating cell to control flow and current effects during electrolytic deposition of soft metals such as indium, tin, and lead.

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Selected Patents

• 9107303 Warp compensated electronic assemblies
• 7969026 Flexible carrier for high volume electronic package fabrication
• 7838420 Method for forming a packaged semiconductor device
• 7802359 Electronic assembly manufacturing method
• 7741151 Integrated circuit package formation
• 7595226 Method of packaging an integrated circuit die
• 7442581 Flexible carrier and release method for high volume electronic package
• 7078796 Corrosion-resistant copper bond pad and integrated device
• 6953985 Wafer level MEMS packaging
• 6949398   Low cost fabrication and assembly of lid for semiconductor devices
• 6302775 Apparatus and method for cold cross-sectioning of soft materials
• 5674780& Method of forming an electrically conductive polymer bump over an aluminum
• 5411400 Interconnect system for a semiconductor chip and a substrate
• 5409567 Method of etching copper layers
• 5028454 Electroless plating of portions of semiconductor devices and the like
• 4946376 Backside metallization scheme for semiconductor devices
• 4787958 Method of chemically etching TiW and/or TiWN

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Selected Publications

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Related Expirience

Bill's enjoyment of history and expertise has led him to the Superstition Mountain Lost Dutchman Museum, where he helps fellow volunteers restore and operate vintage mining equipment while educating visitors on gold and silver extraction methods from the late 1800s and early 1900s. He also set up a replica assay office using his knowledge of analytical chemistry.
His passion for acoustic music inspired him to apply his knowledge in physics and materials to create and build hammered dulcimers. One of his instruments was accepted by the internationally renowned Musical Instrument Museum in Phoenix. He is also a musician, frequently performing traditional music for contra dances.

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Training

Six Sigma Methodology, Chemical Waste Handling

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