Faraday Solutions

A consulting/contract solution for your R&D or manufacturing chemistry needs in process development and materials knowledge.

Microinductor

Bill Lytle is Faraday Solutions, a highly innovative scientist with strong problem-solving skills and expertise in electrolytic and electroless metal plating. He holds an M.S. in chemistry and has extensive experience in metal deposition, etching, polymer technologies, and process development. Bill is skilled at transferring laboratory developments to manufacturing and solving engineering challenges.

TSV

Bill Lytle earned his B.S. in chemistry from the University of Cincinnati and his M.S. from Arizona State University, specializing in inorganic and solid state chemistry. He started working at Motorola in 1982, focusing on semiconductor packaging with an emphasis on flip chip bumping development. Bill developed expertise in electrolytic copper and lead-free plating processes, along with seed metal etchants for flip chip bump applications. Later, he invented an electroless nickel under bump metallization process aimed at low-cost flip chip bumping solutions, which also involved work on environmentally friendly solder pastes. He played a key role in initiating the development of Freescale’s innovative Redistributed Chip Package (RCP), a Fan Out Wafer Level Packaging (FOWLP) technology, creating several vital processes for it. Bill is now the founder of Faraday Solutions, LLC, helping companies develop or troubleshoot plating and packaging processes in sectors such as solar energy, semiconductor and medical devices. He holds 29 issued US patents and has written or co-written more than 20 professional publications, including a book chapter about lead-free alloy plating.